Schneider Electric, the leader in the digital transformation of energy management and automation, has unveiled its world-leading portfolio of end-to-end liquid cooling solutions for hyperscale, colocation and high-density data centre environments, engineered to enable the AI Factories of the Future.
Available globally, the Motivair by Schneider Electric cooling solutions meet the power and GPU-intensive demands of high-density data centres reliably and at scale.
The complete liquid and air-cooled portfolio comprises data centre physical infrastructure, including CDUs, RDHx, HDUs, cold plates, chillers and more, as well as software and services.
All designed to handle the thermal management requirements of next-generation high-performance computing (HPC), AI and accelerated computing workloads.
The announcement offers the first comprehensive view of Schneider Electric’s complete liquid cooling capabilities since acquiring a controlling interest in Motivair in February 2025.
As the industry surpasses densities of 140kW per rack and provisions for future power densities of 1MW and higher, AI chips become hotter and denser. Data centres require liquid cooling to effectively cool hotter workloads and keep critical infrastructure running at peak uptime and efficiency.
Cooling can consume up to 40% of a data centre’s power budget. Direct liquid cooling is up to 3,000 times more effective and more efficient at removing heat than air, because it captures heat directly at the chip level.
Deploying liquid cooling technology is complex and requires a comprehensive, end-to-end approach that encompasses technology sourcing, installation, and ongoing maintenance.
To address these challenges, Schneider Electric and Motivair are providing customers with the most comprehensive data centre and liquid cooling portfolio available in the market, inclusive of all core cooling infrastructure, alongside a supply chain capable of serving global demands.
“As data centre cooling has grown more complex in the AI era, our portfolio has consistently evolved to remain capable of serving the infrastructure demands of today and tomorrow,” said Richard Whitmore, CEO of Motivair by Schneider Electric.
Whitmore added, “Today, we are the only liquid cooling provider to demonstrate proven expertise at the silicon level by co-developing our solutions in collaboration with NVIDIA and other leading GPU manufacturers. In collaboration with Schneider Electric, we have created an unmatched portfolio that not only compresses time-to-market but also increases ROI for customers worldwide.”
Motivair by Schneider Electric’s liquid and air-cooled solutions include megawatt-class Coolant Distribution Units (CDUs), ChilledDoor® Rear Door Heat Exchangers, and Dynamic® Cold Plates, which deliver precise thermal control for 100kW+ AI racks.
The solutions also safeguard peak performance, while enhancing energy efficiency and uptime for data centre operators.
